Title:
SEMICONDUCTOR DEVICE, INVERTER UNIT, AND AUTOMOBILE
Document Type and Number:
WIPO Patent Application WO/2018/087890
Kind Code:
A1
Abstract:
A semiconductor chip (2a) is bonded to the upper surface of a conductor substrate (1a). A control terminal (11a) is disposed further toward the outside than the semiconductor chip (2a), and is connected, using a conductive wire (12a), to a control electrode of the semiconductor chip (2a). A case (10) surrounds the semiconductor chip (2a). A sealing material (13) seals the semiconductor chip (2a). A lead frame (4) has: a bonding portion (4a) bonded to the semiconductor chip (2a); and a perpendicular portion (4b), which is incorporated into the case (10), and which is led out from the bonding portion (4a) to the outside of the control terminal (11a), said perpendicular portion rising in the direction perpendicular to the upper surface of the semiconductor chip (2a).
More Like This:
| JPS60257550 | SEMICONDUCTOR DEVICE |
| JP2704342 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
Inventors:
NAKATA YOSUKE (JP)
IMOTO YUJI (JP)
SASAKI TAISHI (JP)
KAWASE TATSUYA (JP)
IMOTO YUJI (JP)
SASAKI TAISHI (JP)
KAWASE TATSUYA (JP)
Application Number:
PCT/JP2016/083541
Publication Date:
May 17, 2018
Filing Date:
November 11, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/48; H01L23/28; H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| WO2015152373A1 | 2015-10-08 |
Foreign References:
| JP2010177573A | 2010-08-12 | |||
| JP2015046416A | 2015-03-12 | |||
| JPH01107144U | 1989-07-19 | |||
| JP2009111319A | 2009-05-21 | |||
| JP2010225720A | 2010-10-07 | |||
| JP2016076670A | 2016-05-12 | |||
| JP2003158231A | 2003-05-30 |
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
Download PDF: