Title:
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/049685
Kind Code:
A1
Abstract:
A semiconductor device manufacturing device (10) comprises: a stage (16); two bonding heads (14f), (14s) which are mutually independently horizontally movable; and a controller (18) for causing each of the two bonding heads (14f), (14s) to perform a positioning process for horizontal positioning, a grounding process for lowering the chip (100) until the chip (100) is grounded on a substrate (110), and a pressurizing process for applying a bonding load to the chip (100) that is grounded. The controller (18) causes the two bonding heads (14f), (14s) to perform the positioning process and the grounding process independently from each other in a non-pressurizing period in which neither of the bonding heads (14f), (14s) is performing the pressurizing process, and causes the two bonding heads (14f), (14s) after completing the positioning process and the grounding process to perform the pressurizing process in parallel.
Inventors:
SEYAMA KOHEI (JP)
TAKAHASHI MAKOTO (JP)
TAKAHASHI MAKOTO (JP)
Application Number:
PCT/JP2020/033336
Publication Date:
March 10, 2022
Filing Date:
September 02, 2020
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52
Domestic Patent References:
| WO2014157134A1 | 2014-10-02 |
Foreign References:
| US20200083193A1 | 2020-03-12 | |||
| JP2002368021A | 2002-12-20 | |||
| JP2004303757A | 2004-10-28 | |||
| JPH06177179A | 1994-06-24 | |||
| JP2012028587A | 2012-02-09 | |||
| JP2011040489A | 2011-02-24 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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