SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME

Title:

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME

Document Type and Number:

WIPO Patent Application WO/2012/053205

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a semiconductor device that is highly reliable even if the semiconductor device is miniaturized. The semiconductor device has: a resin housing (4); a first lead frame (1) having a first relay lead (1b), a first die pad (1c) with a power element (T1) mounted thereupon, and a first external connection lead (1a1) with one end protruding from the housing (4); and a second lead frame (2) having a second relay lead (2b), a second die pad (2c) with a control element (T2) mounted thereupon, and a second external connection lead (2a) with one end protruding from the housing (4). A connection either between the first die pad part (1c) and the second die part (2c) or between the first external connection lead (1a) and the second relay lead (2b) is formed at a junction. The end of the second relay lead (2b), which extends from the junction with the first relay part (1b), and/or the end of a hanging lead (2e) of the second die pad (2c), is/are positioned inside the housing (4).

Inventors:

MINAMIO MASANORI
TANAKA ZYUNYA
IJIMA SHIN-ICHI

Application Number:

PCT/JP2011/005865

Publication Date:

April 26, 2012

Filing Date:

October 20, 2011

Export Citation:

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Assignee:

PANASONIC CORP (JP)
MINAMIO MASANORI
TANAKA ZYUNYA
IJIMA SHIN-ICHI

International Classes:

H01L23/50; H01L23/48; H01L25/07; H01L25/18

Foreign References:

JPH09102571A	1997-04-15
JPH05190734A	1993-07-30
JP2004022601A	2004-01-22
JPH11233712A	1999-08-27
JP2005150595A	2005-06-09

Other References: