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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/086100
Kind Code:
A1
Abstract:
A semiconductor device (100) is provided with: an interposer (110); a semiconductor chip (101) disposed on the interposer (110); and an interposer (120) disposed on a region of the interposer (110), where the semiconductor chip (101) is not disposed. The interposer (110) is provided with: a through-electrode (111) for electrically connecting with the semiconductor chip (101); and a through-electrode (111) for electrically connecting with the interposer (120).

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Inventors:
DOMAE SHINICHI
Application Number:
PCT/JP2011/003816
Publication Date:
June 28, 2012
Filing Date:
July 04, 2011
Export Citation:
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Assignee:
PANASONIC CORP (JP)
DOMAE SHINICHI
International Classes:
H01L25/065; H01L25/07; H01L25/18
Foreign References:
JP2001210954A2001-08-03
JP2004304023A2004-10-28
JP2003347722A2003-12-05
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
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