Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/029398
Kind Code:
A1
Abstract:
A semiconductor device (10) comprises: a semiconductor layer (14) including a peripheral region (40) and an inner region (42); a gate wire (44); and a source wire (34). A plurality of peripheral gate fingers (46) of the gate wire (44) are spaced apart from each other by a plurality of gaps (48) disposed along the outer edge of the inner region (42). The inner region (42) includes a plurality of sub-regions (52) divided by at least two mutually intersecting inner gate fingers (50) of the gate wire (44). A peripheral segment (58) of the source wire (34) is continuous with at least two of a plurality of inner segments (56) that are respectively disposed in the plurality of sub-regions (52). Each of the at least two inner segments (56) is connected to the peripheral segment (58) via a gap (48), among the plurality of gaps (48), that is adjacent to the sub-region (52) in which the inner segment (56) is disposed.
Inventors:
CLENDENNEN CASEY (JP)
Application Number:
PCT/JP2023/027163
Publication Date:
February 08, 2024
Filing Date:
July 25, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/78; H01L29/06
Foreign References:
| JP2019140169A | 2019-08-22 | |||
| JP2017147431A | 2017-08-24 | |||
| JP2014003191A | 2014-01-09 | |||
| US20130161792A1 | 2013-06-27 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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