Title:
SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/113290
Kind Code:
A1
Abstract:
A method for manufacturing a semiconductor element, comprising: forming a superimposed frame (1) having a barrier layer (2), the superimposed frame comprising a lead frame (11), a chip (12), and a copper bridge frame (13) which are stacked upwardly in sequence, the lead frame being provided with the barrier layer, and the barrier layer being disposed around the outside of the copper bridge frame continuously; filling a space between the barrier layer and the copper bridge frame with a liquid encapsulating material (3), the top surface of the liquid encapsulating material being not higher than the copper bridge frame; and curing the superimposed frame filled with the liquid encapsulating material.
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Inventors:
CAO ZHOU (CN)
Application Number:
PCT/CN2017/093874
Publication Date:
June 28, 2018
Filing Date:
July 21, 2017
Export Citation:
Assignee:
GREAT TEAM BACKEND FOUNDRY DONGGUAN LTD (CN)
International Classes:
H01L21/56; H01L23/31; H01L23/367
Foreign References:
| CN106876342A | 2017-06-20 | |||
| CN104821300A | 2015-08-05 | |||
| CN101567333A | 2009-10-28 | |||
| CN103531551A | 2014-01-22 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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