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Title:
SEMICONDUCTOR LASER EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2005/088789
Kind Code:
A1
Abstract:
Semiconductor laser equipment is provided with a structure, which prevents corrosion of a cooling medium flow path in a heat sink and stably cools a semiconductor laser array for a long period of time. The semiconductor laser equipment is provided with a semiconductor laser stack wherein a plurality of semiconductor laser units are stacked, a cooling medium feeder, piping for connecting the semiconductor laser stack and the cooling medium feeder, and a cooling medium communicating in the above mentioned components. The cooling medium feeder feeds the semiconductor laser stack with the cooling medium. The cooling medium is composed of fluorocarbon. Each of the semiconductor laser units is composed of a pair of the semiconductor laser arrays and the heat sink. The heat sink is provided with the cooling medium flow path.

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Inventors:
MIYAJIMA HIROFUMI (JP)
KAN HIROFUMI (JP)
YAMANAKA MASANOBU (JP)
Application Number:
PCT/JP2005/003980
Publication Date:
September 22, 2005
Filing Date:
March 08, 2005
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
MIYAJIMA HIROFUMI (JP)
KAN HIROFUMI (JP)
YAMANAKA MASANOBU (JP)
International Classes:
H01L23/473; H01S5/02; H01S5/024; H01S5/40; (IPC1-7): H01S5/024; H01L23/473
Domestic Patent References:
WO2000011717A12000-03-02
Foreign References:
JPS57141986A1982-09-02
JPH09194204A1997-07-29
JP2003008273A2003-01-10
JPH10209531A1998-08-07
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6, Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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