Title:
SEMICONDUCTOR LASER MODULE
Document Type and Number:
WIPO Patent Application WO/2013/168445
Kind Code:
A1
Abstract:
A semiconductor laser module (1) is mainly configured of a package (3), a semiconductor laser (5), lenses (7, 9, 13), a reflecting mirror (11), an optical fiber (15) and the like. The package (3) is configured of a bottom portion and side surfaces (19a, 19b). The side surfaces (19a, 19b) stand substantially perpendicular to the bottom portion of the package (3). In the semiconductor laser module (1), a plurality of semiconductor laser disposing surfaces (17) are formed in the shape of steps. A semiconductor laser (5) is disposed on each of the semiconductor laser disposing surfaces (17). A lens (7) is disposed in front (in the light output direction) of the semiconductor laser (5). Furthermore, a lens (9) is disposed in front of the lens (7). The reflecting mirror (11) is fixed to the side surface (19a) that is provided to face the output direction of the semiconductor laser (5).
Inventors:
HAYAMIZU NAOKI (JP)
ISHIGE YUTA (JP)
KIMURA TOSHIO (JP)
ISHIGE YUTA (JP)
KIMURA TOSHIO (JP)
Application Number:
PCT/JP2013/053624
Publication Date:
November 14, 2013
Filing Date:
February 15, 2013
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
G02B6/42; H01S5/022
Foreign References:
| JPS61208023A | 1986-09-16 | |||
| US20090245315A1 | 2009-10-01 | |||
| JPH05175614A | 1993-07-13 | |||
| JP2002056563A | 2002-02-22 | |||
| JPH09246658A | 1997-09-19 |
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Seiichi Inoue (JP)
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