Title:
SEMICONDUCTOR PACKAGED DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2024/087083
Kind Code:
A1
Abstract:
A semiconductor packaged device includes a semiconductor die, a plurality of first conductive pads, a conductive layer, a first heat dissipation structure, and a second heat dissipation structure. The semiconductor die has a top surface, a bottom surface, and an inclined side surface connecting the top surface to the bottom surface. The conductive layer is electrically connected with the semiconductor die through one of the first conductive pads, in which the conductive layer extends laterally and downward along the inclined side surface of the semiconductor die. The first heat dissipation structure is disposed over the top surface of the semiconductor die and thermally coupled to the semiconductor die through the first conductive pads. The second heat dissipation structure is disposed under the bottom surface of the semiconductor die and thermally coupled to the semiconductor die.
Inventors:
ZHANG JIANPING (CN)
CAO KAI (CN)
ZHANG LEI (CN)
ZHOU CHUNHUA (CN)
CAO KAI (CN)
ZHANG LEI (CN)
ZHOU CHUNHUA (CN)
Application Number:
PCT/CN2022/127854
Publication Date:
May 02, 2024
Filing Date:
October 27, 2022
Export Citation:
Assignee:
INNOSCIENCE ZHUHAI TECHNOLOGY CO LTD (CN)
International Classes:
H01L23/31
Foreign References:
| CN108364923A | 2018-08-03 | |||
| CN110379798A | 2019-10-25 | |||
| CN105405877A | 2016-03-16 | |||
| CN113314480A | 2021-08-27 | |||
| US20190013346A1 | 2019-01-10 |
Attorney, Agent or Firm:
BEIJING BESTIPR INTELLECTUAL PROPERTY LAW CORPORATION (CN)
Download PDF: