Title:
SEMICONDUCTOR WAFER DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/043403
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor wafer defect inspection device and defect inspection method, the device comprising: an inspection module which has a camera for photographing a wafer, and which is provided inside a wafer movement space; sensor A and sensor B provided on a straight line path, which is the same as that of the moving direction of the wafer, so as to sense the wafer; a frame trigger for generating an (on) trigger signal if the sensor A and/or the sensor B senses the wafer; a frame grabber for generating a camera photography start signal if the trigger signal is input from the frame trigger, and generating a camera photography end signal if the trigger signal is not input; and a management computer, which generates a wafer image by using a digital signal converted by the frame grabber, displays the generated image on a connected monitor, and detects a defect of the wafer by comparing the generated wafer image to a previously prepared normal image or comparing, to each other, die images in wafer images.
Inventors:
PARK JEONG OK (KR)
Application Number:
PCT/KR2022/019094
Publication Date:
February 29, 2024
Filing Date:
November 29, 2022
Export Citation:
Assignee:
MIR TECH INC (KR)
International Classes:
G01N21/88; G01N21/89; G01N21/95; G01R31/28
Foreign References:
| KR20100049781A | 2010-05-13 | |||
| KR20150049799A | 2015-05-08 | |||
| JP2009113888A | 2009-05-28 | |||
| JP2016020824A | 2016-02-04 | |||
| KR100374762B1 | 2003-03-04 |
Attorney, Agent or Firm:
JUNG, Young Hoon (KR)
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