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Title:
SHAPE MEASUREMENT METHOD AND SHAPE MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/081959
Kind Code:
A1
Abstract:
A measurement unit (100) measures the cross-sectional shape of an edge part (300) of a semiconductor wafer (10) (S201). The measurement unit (100) measures the cross-sectional shape of an edge part (300) of a support member (20) (S203). The measurement unit (100) measures the cross-sectional shape of an edge part (400) of a bonded wafer (30) (S205). An analysis unit (220) subtracts the thickness (t1) of the semiconductor wafer (10) and the thickness (t2) of the support member (20) from the thickness (t4) of the bonded wafer to calculate the thickness (t3) of an adhesive (40) (S207).

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Inventors:
HASHIZUME HIDEHISA
TAKAMI SHUNSUKE
HARANO NORIHISA
Application Number:
PCT/JP2016/079594
Publication Date:
May 18, 2017
Filing Date:
October 05, 2016
Export Citation:
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Assignee:
KOBELCO RES INST INC (JP)
International Classes:
G01B11/24; G01B11/06; G06T7/60; H01L21/66
Foreign References:
JP2014500952A2014-01-16
JP2009156686A2009-07-16
JP2013137295A2013-07-11
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
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