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Patent Searching and Data


Title:
SHEET MATERIAL, BONDED BODY, METHOD FOR BONDING SHEET MATERIAL, AND METHOD FOR MANUFACTURING SHEET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/167045
Kind Code:
A1
Abstract:
Provided are: a sheet material that can be bonded through smooth laser welding while sufficiently suppressing the occurrence of defects such as blowholes and melting-down; a bonded body in which a sheet material is bonded to a sheet material on a side to be bonded; a method for bonding a sheet material; and a method for manufacturing a sheet material. The sheet material is composed of copper or a copper alloy and is superimposed on and laser-welded onto a sheet material on a side to be bonded composed of copper or a copper alloy, wherein in a surface irradiated by laser light L, a plurality of groove portions intersecting a scanning direction of the laser light are provided at intervals along the scanning direction of the laser light.

Inventors:
TOMARI KEIICHIRO
Application Number:
PCT/JP2023/006083
Publication Date:
September 07, 2023
Filing Date:
February 20, 2023
Export Citation:
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Assignee:
KOBE STEEL LTD (JP)
International Classes:
B23K26/32; B23K26/21; B23K26/364
Foreign References:
JP2012179631A2012-09-20
JP2011025260A2011-02-10
JPH09108874A1997-04-28
JP2002292486A2002-10-08
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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