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Title:
SHEET-SHAPED EPOXY RESIN COMPOSITION, AND SEALING SHEET CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2013/027389
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a resin composition that is for a sheet, has superior adhesion to optical elements and the like and transparency after curing, and resists incorporation of air at the interface between an element and the resin composition for a sheet during thermocompression bonding. The sheet-shaped epoxy resin composition contains (A) an epoxy resin having a weight average molecular weight of 2000 to 1×105 and (B) a curing accelerator, and the storage elastic modulus (G'(50)) at 50°C and the storage elastic modulus (G'(80)) at 80°C satisfies G'(50)/G'(80) < 11, G'(80) being 2500 to 5×105 Pa.

Inventors:
YAMAMOTO YUGO
TAKAGI MASATOSHI
SUZUKI KENJI
OIKE SETSUKO
Application Number:
PCT/JP2012/005230
Publication Date:
February 28, 2013
Filing Date:
August 21, 2012
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
YAMAMOTO YUGO
TAKAGI MASATOSHI
SUZUKI KENJI
OIKE SETSUKO
International Classes:
C08J5/18; C08G59/02; C08J7/04; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
WO2010119706A12010-10-21
WO2001098411A12001-12-27
Foreign References:
JP2005298703A2005-10-27
JP2005126658A2005-05-19
JP2007254743A2007-10-04
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
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