Title:
SILICA PARTICLE DISPERSION, POLISHING COMPOSITION, AND METHOD FOR MANUFACTURING SILICA PARTICLE DISPERSION
Document Type and Number:
WIPO Patent Application WO/2019/189610
Kind Code:
A1
Abstract:
Provided is a polishing composition with which a high polish rate is achieved, surface smoothness (surface quality) of a polishing substrate is improved, and defects can be reduced. Specifically, this polishing composition contains silica particles and a water-soluble polymer, and the polishing composition is characterized in that the silica particles blended in satisfy the requirements that (a) the primary particle size based on specific surface area be 5 to 300 nm, (b) the coefficient of particle size variation be 10% or less, and (c) the Sears number Y be 10.0 to 12.0.
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Inventors:
EGAMI MIKI (JP)
KUMAZAWA MITSUAKI (JP)
MURAGUCHI RYO (JP)
KOMATSU MICHIO (JP)
KUMAZAWA MITSUAKI (JP)
MURAGUCHI RYO (JP)
KOMATSU MICHIO (JP)
Application Number:
PCT/JP2019/013678
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
Assignee:
JGC CATALYSTS & CHEMICALS LTD (JP)
International Classes:
C09K3/14; B24B37/00; C01B33/141; C09G1/02; H01L21/304
Domestic Patent References:
| WO2014007063A1 | 2014-01-09 | |||
| WO2017200297A1 | 2017-11-23 |
Foreign References:
| JP2014022511A | 2014-02-03 | |||
| JP2014140056A | 2014-07-31 | |||
| JP2012518127A | 2012-08-09 | |||
| JP2010028078A | 2010-02-04 | |||
| JP2005060219A | 2005-03-10 |
Attorney, Agent or Firm:
TAKATSU Kazuya (JP)
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