Title:
SILICONE RESIN DISSOLVING AGENT AND METHOD FOR SEPARATING SILICONE COATING AND BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/029266
Kind Code:
A1
Abstract:
The present invention is a silicone resin dissolving agent comprising: (A) 1-90 mass% of a siliconate compound represented by general formula (1) and/or (2) (in the formulas, each R is independently a group selected C6-10 aryl groups and C1-10 alkyl groups that may be substituted with a halogen atom, M is a positive ion selected from among alkali metal ions, tetraalkylammonium ions, benzyltrialkylammonium ions, and tetraalkylphosphonium ions, and n is an integer of 0-200); and (B) 99-10 mass% of an aprotic organic solvent which has a relative dielectric constant of not more than 10.0. Thus, provided is a silicone resin dissolving agent for dissolving a silicone resin from a molded article in which a resin substrate or metal substrate and a silicone resin such as silicone rubber are integrated, and for recovering the substrate.
Inventors:
ASHIDA RYO (JP)
UBUKATA SHIGERU (JP)
HIRABAYASHI SATAO (JP)
UBUKATA SHIGERU (JP)
HIRABAYASHI SATAO (JP)
Application Number:
PCT/JP2023/025117
Publication Date:
February 08, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09D9/00; C08K5/01; C08L83/06
Foreign References:
| JP2008169336A | 2008-07-24 | |||
| JP2014205738A | 2014-10-30 | |||
| JPH10251566A | 1998-09-22 | |||
| JP2014524941A | 2014-09-25 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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