SILVER ALLOY COMPOSITION FOR FORMING CONDUCTIVE FILM, AND PREPARATION METHOD THEREFOR

Title:

SILVER ALLOY COMPOSITION FOR FORMING CONDUCTIVE FILM, AND PREPARATION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2017/195929

Kind Code:

A1

Abstract:

The present invention relates to a silver alloy composition. Disclosed as embodiments of the present invention are: a silver alloy composition comprising 0.01-5.0 wt% of indium (In), 0.01-5.0 wt% of at least one or more elements of zinc (Zn), magnesium (Mg), platinum (Pt) and palladium (Pd), and the balance of silver (Ag) and inevitable impurities, having a grain size of 10-100 μm, and having a light reflectivity of 95% or more at a wavelength of 550 nm; and a preparation method therefor.

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Inventors:

LEE HYO-WON (KR)
KIM DONG-WOOK (KR)
HONG GIL-SOO (KR)
PARK JOO-HYEON (KR)

Application Number:

PCT/KR2016/007096

Publication Date:

November 16, 2017

Filing Date:

July 01, 2016

Export Citation:

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Assignee:

HEE SUNG METAL LTD (KR)

International Classes:

C22C5/06; B21B3/00; B21J1/00; B22D21/00; C22F1/14; H01L31/04

Foreign References:

KR20140134727A	2014-11-24
KR20140015432A	2014-02-06
KR20080101071A	2008-11-21
KR20090112478A	2009-10-28
KR20150085236A	2015-07-23

Attorney, Agent or Firm:

C.M. PATENT & LAW FIRM. LLP (KR)

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