SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR MANUFACTURING SAME

Title:

SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2013/108916

Kind Code:

A1

Abstract:

A copper alloy powder (preferably a copper alloy powder in which the cumulative 50% particle diameter (D50 diameter) measured using a laser diffraction granularity distribution device is 0.1-15 μm) containing at least one of zinc and nickel at 1-50 mass% with the remainder composed of copper and unavoidable impurities is covered by a layer containing 7-50 mass% silver, preferably a layer made from silver or a silver compound, whereby a silver-coated copper alloy powder having a low volume resistance and an excellent storage stability (reliability) is manufactured.

Inventors:

INOUE KENICHI (JP)
OGI KOZO (JP)
EBARA ATSUSHI (JP)
HIYAMA YUTO (JP)
YAMADA TAKAHIRO (JP)
UEYAMA TOSHIHIKO (JP)

Application Number:

PCT/JP2013/051019

Publication Date:

July 25, 2013

Filing Date:

January 15, 2013

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)

International Classes:

B22F1/05; B22F1/107; B22F1/17; B22F9/08; C22C9/00; C22C9/04; C22C9/06; H01B1/22; H01B5/00; H01B5/14; H01B13/00

Foreign References:

JP2012180564A	2012-09-20
JP2003068139A	2003-03-07
JP2002332501A	2002-11-22
JP2010174311A	2010-08-12
JP2010077495A	2010-04-08
JPH08311304A	1996-11-26
JPH10152630A	1998-06-09

Other References: