Title:
SILVER-COATED COPPER POWDER, COPPER PASTE USING SAME, CONDUCTIVE COATING MATERIAL, CONDUCTIVE SHEET, AND METHOD FOR PRODUCING SILVER-COATED COPPER POWDER
Document Type and Number:
WIPO Patent Application WO/2016/185628
Kind Code:
A1
Abstract:
Provided is a silver-coated copper powder which is capable of being suitably employed for use as a conductive paste, an electromagnetic-wave shield, and the like, while ensuring excellent conductivity by increasing contact points between the copper powder. A silver-coated copper powder 1 according to the present invention forms a dendritic shape having a trunk 2 which grows linearly, and a plurality of branches 3 which branch off from the trunk 2. Plate-shaped copper particles having an average cross-sectional thickness obtained from a scanning electron microscope (SEM) observation of 0.02-5.0 µm agglomerate to form the trunk 2 and the branches 3. The surfaces of the copper particles are coated with silver. The average particle size (D50) of the silver-coated copper powder 1 is 1.0-100 µm. The maximum height of the plate-shaped surfaces of the copper particles in the vertical direction is not more than 1/10 of the maximum length of the plate-shaped surfaces in the horizontal direction.
Inventors:
OKADA HIROSHI (JP)
Application Number:
PCT/JP2015/080258
Publication Date:
November 24, 2016
Filing Date:
October 27, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B22F1/068; B22F1/10; B22F1/102; B22F1/17; B22F9/24; C23C18/42; C25C5/02; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
| WO2015060258A1 | 2015-04-30 |
Foreign References:
| JP2013100592A | 2013-05-23 | |||
| JP2013089576A | 2013-05-13 | |||
| JP5503813B1 | 2014-05-28 | |||
| JP5790900B1 | 2015-10-07 |
Other References:
See also references of EP 3296042A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
正林 真之 (JP)
正林 真之 (JP)
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