SILVER NANOWIRE ASSEMBLY, SILVER NANOWIRE INK, TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCING SILVER NANOWIRE ASSEMBLY, METHOD FOR PRODUCING SILVER NANOWIRE INK, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM

WIPO Patent Application WO/2020/090689

A1

A silver nanowire assembly according to the present invention has an average diameter and a length distribution of silver nanowires within predetermined ranges. A silver nanowire ink according to the present invention is obtained by dispersing the silver nanowire assembly in a liquid medium. A transparent conductive film according to the present invention has the silver nanowire assembly on a transparent base material. A method for producing a silver nanowire assembly and a method for producing a silver nanowire ink according to the present invention comprise a step for synthesizing silver nanowires and a step for performing further dispersion process by means of a thin-film spin method. A method for producing a transparent conductive film according to the present invention also comprises, in addition to the above-described steps, a step for applying silver nanowires in an ink state onto the transparent base material.

JPH0733557	[Title of the Invention] A method for producing an iron-based sintered wear-resistant material.
WO/2017/138433	IRON-BASED POWDER FOR POWDER METALLURGY, AND METHOD FOR MANUFACTURING IRON-BASED POWDER FOR POWDER METALLURGY

SATO KIMITAKA (JP)
KURITA SATORU (JP)

PCT/JP2019/042054

May 07, 2020

October 25, 2019

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DOWA ELECTRONICS MATERIALS CO (JP)

B22F1/00; B22F9/00; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00; B22F9/24

WO2016035856A1	2016-03-10
WO2014157259A1	2014-10-02

SUGIMURA Kenji (JP)

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