SILVER POWDER FOR SINTERED ELECTRICALLY CONDUCTIVE PASTE

Title:

SILVER POWDER FOR SINTERED ELECTRICALLY CONDUCTIVE PASTE

Document Type and Number:

WIPO Patent Application WO/2013/084683

Kind Code:

A1

Abstract:

Provided is a novel microparticlulate silver powder which can cope with the formation of a fine-line electrode or circuit and has a low thermal shrinkage ratio at 500ºC. Proposed is a silver powder for a sintered electrically conductive paste, characterized by containing 30 to 1000 ppm of silicon (Si).

Inventors:

MATSUYAMA TOSHIKAZU (JP)
MIYANOHARA KEISUKE (JP)

Application Number:

PCT/JP2012/079626

Publication Date:

June 13, 2013

Filing Date:

November 15, 2012

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Assignee:

MITSUI MINING & SMELTING CO (JP)

International Classes:

B22F1/00; B22F1/06; C22C5/06; H01B1/00; H01B1/22; H01B5/00; B22F9/24

Foreign References:

JP2006302525A	2006-11-02
JP2010206197A	2010-09-16
JP2010070793A	2010-04-02
JP2004079211A	2004-03-11
JPH08143989A	1996-06-04

Attorney, Agent or Firm:

TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)

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