SLURRY COMPOSITION FOR METAL POLISHING

Title:

SLURRY COMPOSITION FOR METAL POLISHING

Document Type and Number:

WIPO Patent Application WO/2023/022419

Kind Code:

A1

Abstract:

The present invention relates to a slurry composition for metal polishing, comprising: colloidal silica; and an oxidizing agent; and at least one selected from among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer, wherein the colloidal silica has a particle size distribution according to equation 1.

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Inventors:

HWANG JIN SOOK (KR)
KONG HYUN GOO (KR)
KIM YUN SU (KR)

Application Number:

PCT/KR2022/011727

Publication Date:

February 23, 2023

Filing Date:

August 08, 2022

Export Citation:

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Assignee:

KCTECH CO LTD (KR)

International Classes:

C09G1/02; C09K3/14; C23F1/26; C23F3/06; H01L21/306

Foreign References:

KR20200053997A	2020-05-19
KR20150019046A	2015-02-25
KR20170072524A	2017-06-27
KR20130019332A	2013-02-26

Other References:

YUN HYE WON, KIM DOYEON, HAN DO HYUNG, KIM DONG WAN, KIM WOO-BYOUNG: "Effect of Surfactant on the Dispersion Stability of Slurry for Semiconductor Silicon CMP", JOURNAL OF KOREAN POWDER METALLURGY INSTITUTE, vol. 25, no. 5, 30 October 2018 (2018-10-30), pages 395 - 401, XP093036245, ISSN: 1225-7591, DOI: 10.4150/KPMI.2018.25.5.395

Attorney, Agent or Firm:

MUHANN PATENT & LAW FIRM (KR)

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