SOLDER POWDER AND METHOD FOR PREPARING THE SAME AND SOLDER PASTE

Title:

SOLDER POWDER AND METHOD FOR PREPARING THE SAME AND SOLDER PASTE

Document Type and Number:

WIPO Patent Application WO/2000/001506

Kind Code:

A1

Abstract:

An organic acid salt is deposited on the surface of a solder powder containing Sn and Zn. Alternatively, 0.5 to 10 wt.% of a nonionic surfactant is added to a flux. By a method comprising such a procedure, provided are a lead-free solder powder and solder paste having good soldering characteristics wherein the reaction of an activating component with an alloy component in a flux is suppressed.

Inventors:

HIRATA MASAHIKO (JP)
OHASHI TAKASHI (JP)
YOSHIDA HISAHIKO (JP)
NOGUCHI HIROJI (JP)
HISAZUMI TAKAO (JP)
SENNA MAMORU (JP)
ISOBE TETSUHIKO (JP)

Application Number:

PCT/JP1999/003568

Publication Date:

January 13, 2000

Filing Date:

July 01, 1999

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
HIRATA MASAHIKO (JP)
OHASHI TAKASHI (JP)
YOSHIDA HISAHIKO (JP)
NOGUCHI HIROJI (JP)
HISAZUMI TAKAO (JP)
SENNA MAMORU (JP)
ISOBE TETSUHIKO (JP)

International Classes:

B23K35/02; B23K35/14; B23K35/36; H05K3/34; (IPC1-7): B23K35/14; B23K35/22; B23K35/26; B23K35/40; H05K3/34

Foreign References:

JPH09327789A	1997-12-22
JPH01157793A	1989-06-21
JPH08164496A	1996-06-25
JPH10175092A	1998-06-30
JP2780474B2	1998-07-30
JPH04200993A	1992-07-21

Other References:

ANADA T, ET AL.: "DEVELOPMENT OF FLUX FOR SN-ZN SYSTEM SOLDER PASTE", SYMPOSIUM ON MICROJOINING AND ASSEMBLY TECHNOLOGY AND ELECTRONICS, XX, XX, 29 January 1998 (1998-01-29), XX, pages 271 - 274, XP002920078

Attorney, Agent or Firm:

Ikeuchi, Hiroyuki (Umeda Plaza Building 3-25, Nishitenma 4-chome Kita-ku Osaka-shi Osaka, JP)

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