Title:
SOLDER POWDER AND PROCESS FOR PRODUCING SOLDER POWDER
Document Type and Number:
WIPO Patent Application WO/2012/066664
Kind Code:
A1
Abstract:
[Problem] To obtain a solder powder having an average particle diameter of 0.05 µm or more but less than 3 µm.
[Solution] A solder powder having an average particle diameter of, for example, 0.05 µm or more but less than 3 µm is obtained by using a process for solder powder production which comprises a step in which a solid or liquid metal, a nonaqueous solvent, and balls for pulverization which have a diameter of 0.05-5 mm are introduced into a vessel to obtain a mixture, a step in which the mixture is heated to 150ºC or higher and stirred, a step in which the balls for pulverization are separated from the stirred mixture to obtain a mixture of a solder powder and the nonaqueous solvent, and a step in which the solder powder/nonaqueous-solvent mixture is subjected to solid/liquid separation to obtain the solder powder.
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Inventors:
ISHIKAWA YUICHI (JP)
Application Number:
PCT/JP2010/070562
Publication Date:
May 24, 2012
Filing Date:
November 18, 2010
Export Citation:
Assignee:
DOWA HOLDINGS CO LTD (JP)
ISHIKAWA YUICHI (JP)
ISHIKAWA YUICHI (JP)
International Classes:
B22F9/06
Domestic Patent References:
| WO2009011981A2 | 2009-01-22 |
Foreign References:
| JP2009199746A | 2009-09-03 | |||
| JPS64204A | 1989-01-05 | |||
| JPH0533017A | 1993-02-09 | |||
| JP2004098118A | 2004-04-02 | |||
| JP2002519509A | 2002-07-02 | |||
| DE4402042A1 | 1994-06-09 |
Other References:
See also references of EP 2641676A4
Attorney, Agent or Firm:
HAGIWARA, Yasushi et al. (JP)
Yasushi Hagiwara (JP)
Yasushi Hagiwara (JP)
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Claims:
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