Title:
SOLDERING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/102156
Kind Code:
A1
Abstract:
A soldering apparatus comprising a cooling zone, an upper and a lower vent, an external passage, a blower unit, a heat exchanger, a pair of bypass passages, and a ventilation plate. The upper and lower vents are respectively provided over and under a pair of rails for transporting a substrate in the cooling zone. The external passage connects the upper and lower vents outside the cooling zone. The blower unit causes gas in the external passage to flow in the order of the upper vent, the cooling zone, and the lower vent before returning the gas back to the external passage. The heat exchanger is provided in a lower opening portion connecting to the lower vent in the cooling zone, to cool the gas passing through the lower opening portion. The pair of bypass passages respectively send the gas over the pair of rails to the lower opening portion while bypassing the locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass passages. The ventilation plate has a slit for sending the gas under the pair of rails to the lower opening portion.
Inventors:
SAITO YUTA (JP)
Application Number:
PCT/JP2021/022533
Publication Date:
May 19, 2022
Filing Date:
June 14, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; B23K1/008; B23K3/00
Foreign References:
| JPH0550218A | 1993-03-02 | |||
| JPH07336040A | 1995-12-22 | |||
| JPH0587987U | 1993-11-26 | |||
| JPH10200253A | 1998-07-31 | |||
| JP2011121101A | 2011-06-23 | |||
| JP2559743Y2 | 1998-01-19 |
Other References:
See also references of EP 4213600A4
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
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