Title:
SOLDERING METHOD, SOLDER PELLET FOR DIE BONDING, METHOD FOR MANUFACTURING SOLDER PELLET FOR DIE BONDING AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2005/119755
Kind Code:
A1
Abstract:
A pellet which generates less voids at the time of die bonding a semiconductor element of an electronic component on a board, even it is lead-free. In the pellet, on a surface of a lead-free solder alloy having Sn as a major ingredient, a transparent and colorless Sn-based protecting film, including an O of 30-50at% and a P of 5-15at%, or that including an In of 10-30at%, an O of 40-60at% and a P of 5-15at%, is formed when heated for soldering. The pellet has a thickness of 0.05-1mm and has a shape substantially the same as that of the board.
Inventors:
UESHIMA MINORU (JP)
Application Number:
PCT/JP2005/009630
Publication Date:
December 15, 2005
Filing Date:
May 26, 2005
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
UESHIMA MINORU (JP)
UESHIMA MINORU (JP)
International Classes:
B23K35/02; B23K35/26; H01L21/52; H01L21/60; (IPC1-7): H01L21/52; B23K35/26
Foreign References:
| JP2001284792A | 2001-10-12 | |||
| JPH0449630A | 1992-02-19 | |||
| JPH1158066A | 1999-03-02 | |||
| JPH0592292A | 1993-04-16 | |||
| JPH0629331A | 1994-02-04 |
Other References:
See also references of EP 1783827A4
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