Title:
SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/016570
Kind Code:
A1
Abstract:
[Solution] A first solid-state image pickup element of an embodiment of the present disclosure is provided with: a lower electrode; an upper electrode placed opposed to the lower electrode; a photoelectric conversion layer provided between the lower electrode and the upper electrode, and containing a first organic semiconductor material; and an upper intermediate layer provided between the upper electrode and the photoelectric conversion layer, for which the concentration of a second organic semiconductor material which has halogen atoms within the molecules is 0 volume% or greater and less than 0.05 volume%.
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Inventors:
HIROSE YOHEI (JP)
YAGI IWAO (JP)
HIRATA SHINTAROU (JP)
MOGI HIDEAKI (JP)
BANDO MASASHI (JP)
ENOKI OSAMU (JP)
YAGI IWAO (JP)
HIRATA SHINTAROU (JP)
MOGI HIDEAKI (JP)
BANDO MASASHI (JP)
ENOKI OSAMU (JP)
Application Number:
PCT/JP2017/026243
Publication Date:
January 25, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
SONY CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/30; H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H01L31/10; H01L51/42; H04N5/369
Foreign References:
JP2015233117A | 2015-12-24 | |||
US20150325797A1 | 2015-11-12 | |||
JP2016025342A | 2016-02-08 | |||
JP2007088033A | 2007-04-05 | |||
JP2015195333A | 2015-11-05 |
Other References:
See also references of EP 3490003A4
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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