Title:
STACKABLE MICROCIRCUIT AND METHOD OF MAKING THE SAME
Document Type and Number:
WIPO Patent Application WO2003005782
Kind Code:
A3
Abstract:
A Neo layer (107, 285) is provided with at least one die (10) having a microelectronic device on an active surface (55) of the die (10). The dies (10) are supported on a support substrate (105, 300) that can be readily handled by machines in an automated manufacturing setting. Both of the die (10) and the substrate (105, 300) are encapsulated in a layer material to provide a distinctive Neo layer or Neo PEM. The different embodiments offer additional respective advantages of improved manufacturability. Further versatility is provided by enabling use of dies (10) from different sources including bare dies (10) and dies (10) that are already packaged in a Plastic Embedded Microcircuit (PEM), for example. The ongoing goal of providing a stackable array of Neo layers (107, 285) is still met.
Inventors:
ANDREWS LAWRENCE D (US)
ALBERT DOUGLAS M (US)
ALBERT DOUGLAS M (US)
Application Number:
PCT/US2002/021101
Publication Date:
August 28, 2003
Filing Date:
July 02, 2002
Export Citation:
Assignee:
IRVINE SENSORS CORP (US)
ANDREWS LAWRENCE D (US)
ALBERT DOUGLAS M (US)
ANDREWS LAWRENCE D (US)
ALBERT DOUGLAS M (US)
International Classes:
H01L21/98; H01L25/10; (IPC1-7): H05K3/34; H01L23/28
Foreign References:
| US5086018A | 1992-02-04 | |||
| US6342398B1 | 2002-01-29 | |||
| US6060373A | 2000-05-09 |
Download PDF: