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Title:
STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING APPARATUS, MULTI-COMPONENT TRANSFER APPARATUS, AND METHOD FOR MANUFACTURING ELEMENT ARRAY
Document Type and Number:
WIPO Patent Application WO/2021/201038
Kind Code:
A1
Abstract:
[Problem] To provide: a stamp tool holding apparatus capable of holding a stamp tool while a stamping surface of the stamp tool is kept clean; a stamp positioning apparatus which exhibits easy positioning of the stamp tool with respect to a conveyance head; a multi-component transfer apparatus for efficiently transferring to-be-conveyed components such as elements by using the stamp tool; and a method for manufacturing an element array using these apparatuses. [Solution] A stamp tool holding apparatus 80 has a placement stage 82 on which a stamp tool 10 is placed in an attachable/detachable manner. The placement stage 82 has a placement surface 84 having formed thereon a housing recess 86 for housing a stamp layer 12 of the stamp tool 10. The placement surface 84 has formed thereon a sucking hole 85 by which it is possible to suction, in an attachable/detachable manner, a part of the stamp tool 10 located around the stamp layer 12.

Inventors:
SUNAGA SEIJIRO (JP)
YAMASHITA MAKOTO (JP)
MIYAGOSHI TOSHINOBU (JP)
KATO YASUO (JP)
OTOMO TATSUNORI (JP)
MAKIDA MITSUYOSHI (JP)
SATO YOHEI (JP)
Application Number:
PCT/JP2021/013698
Publication Date:
October 07, 2021
Filing Date:
March 30, 2021
Export Citation:
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Assignee:
TDK CORP (JP)
International Classes:
H01L21/60; H01L21/677; H01L21/683; H05K13/04
Domestic Patent References:
WO2020166184A12020-08-20
Foreign References:
JP2020043209A2020-03-19
JPH11243298A1999-09-07
JP2017175087A2017-09-28
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
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