Title:
SUBSTRATE CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/038877
Kind Code:
A1
Abstract:
Provided is a substrate connection structure that can be realized in a more reduced thickness. An electrical connector (11) of a connector unit (2) is provided with: a housing (22) secured to an LED substrate (10); contacts (21); and reinforcing tabs (23). The housing (22) includes: a bottom wall main body (36) that is disposed surrounding a cutout portion (18) of the LED substrate (10); and supported sections (37) that are disposed on the ends of the bottom wall main body (36) in the width direction (X1) and are supported by a second side surface (16) of the LED substrate (10). The reinforcing tabs (23) each include: a first securing section (45) secured to the bottom wall main body (36); an extending section (46) extending from the first securing section (45) along the width direction (X1) so as to separate from the first securing section (45); and a second securing section (47) formed on the end of the extending section (46), disposed in alignment with the supported section (37) in the length direction (Y1), and secured to the second side surface (16) in a mounting section (19).
Inventors:
NAEMURA RYO (JP)
YOSHII TAKAHIRO (JP)
YOSHII TAKAHIRO (JP)
Application Number:
PCT/JP2016/075508
Publication Date:
March 09, 2017
Filing Date:
August 31, 2016
Export Citation:
Assignee:
J S T MFG CO LTD (JP)
International Classes:
H01R12/79; H01R12/88
Domestic Patent References:
| WO2007039950A1 | 2007-04-12 |
Foreign References:
| JP2000195595A | 2000-07-14 | |||
| US7572130B1 | 2009-08-11 | |||
| JP2006338955A | 2006-12-14 | |||
| JP2015090862A | 2015-05-11 |
Attorney, Agent or Firm:
ONEDEE IP PARTNERS (JP)
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