Title:
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/137652
Kind Code:
A1
Abstract:
This substrate liquid processing apparatus, which supplies a plating solution to a substrate, is provided with: a substrate holding unit which holds the substrate; a plating solution sending unit which sends the plating solution into a first flow channel; a temperature control unit which is connected to the plating solution sending unit via the first flow channel, and which controls the temperature of a fluid that is supplied through the first flow channel; an extrusion fluid sending unit which sends an extrusion fluid into the first flow channel, said extrusion fluid being different from the plating solution; and an ejection unit which is connected to the temperature control unit via a second flow channel, and which ejects a fluid that is supplied through the second flow channel.
Inventors:
INATOMI YUICHIRO (JP)
ESAKI TOMONORI (JP)
ESAKI TOMONORI (JP)
Application Number:
PCT/JP2019/049150
Publication Date:
July 02, 2020
Filing Date:
December 16, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C18/31
Foreign References:
| JPS52144894A | 1977-12-02 | |||
| JP2004140129A | 2004-05-13 | |||
| JP2006111938A | 2006-04-27 | |||
| JP2009179821A | 2009-08-13 | |||
| JP2000129446A | 2000-05-09 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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