Title:
SUBSTRATE FOR MOUNTING ELEMENT THEREON, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING ELEMENT THEREON
Document Type and Number:
WIPO Patent Application WO/2013/046617
Kind Code:
A1
Abstract:
A substrate (100) for mounting an element thereon is provided with: a metal substrate (110); an oxide film (120) formed by oxidizing a surface of the metal substrate (110); an insulating resin layer (130), which is provided on the oxide film (120) on the one main surface side of the metal substrate (110); and a wiring layer (140), which is provided on the insulating resin layer (130). An oxide film (120a) below a semiconductor element (200) is made thicker than the surrounding oxide film (120). Conversely, the insulating resin layer (130) below the semiconductor element (200) is made thinner than the insulating resin layer (130) below the semiconductor element (210).
Inventors:
KOHARA YASUHIRO (JP)
NAGAMATSU MASAYUKI (JP)
DEGUCHI KOUTARO (JP)
NAGAMATSU MASAYUKI (JP)
DEGUCHI KOUTARO (JP)
Application Number:
PCT/JP2012/006032
Publication Date:
April 04, 2013
Filing Date:
September 21, 2012
Export Citation:
Assignee:
SANYO ELECTRIC CO (JP)
International Classes:
H01L23/12; H01L25/07; H01L25/18
Foreign References:
| JP2006100753A | 2006-04-13 | |||
| JP2010500779A | 2010-01-07 | |||
| JP2011222551A | 2011-11-04 |
Attorney, Agent or Firm:
MORISHITA, SAKAKI (JP)
Sakaki Morishita (JP)
Sakaki Morishita (JP)
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Claims: