Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2014/148351
Kind Code:
A1
Abstract:
A block copolymer is applied over the upper surface of a first neutral layer on a wafer and a neutral agent is applied over the upper surface of the block copolymer, thereby forming a second neutral layer. By subjecting the wafer, which has been provided with the second neutral layer on the block copolymer, to a heat treatment, the block copolymer is phase separated into a hydrophilic polymer and a hydrophobic polymer. The neutral agent does not dissolve the block copolymer, and prevents oxygen from reaching the block copolymer during the heat treatment.
Inventors:
MURAMATSU MAKOTO (JP)
KITANO TAKAHIRO (JP)
TOMITA TADATOSHI (JP)
TANOUCHI KEIJI (JP)
OKADA SOICHIRO (JP)
KITANO TAKAHIRO (JP)
TOMITA TADATOSHI (JP)
TANOUCHI KEIJI (JP)
OKADA SOICHIRO (JP)
Application Number:
PCT/JP2014/056674
Publication Date:
September 25, 2014
Filing Date:
March 13, 2014
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; B05D1/36; B05D3/10; B05D5/00; B05D7/24; G03F7/40; B05C11/08
Domestic Patent References:
| WO2008056467A1 | 2008-05-15 | |||
| WO2007116440A1 | 2007-10-18 |
Foreign References:
| JP2011122081A | 2011-06-23 | |||
| JP2008036491A | 2008-02-21 | |||
| JP2007125699A | 2007-05-24 | |||
| JP2005029779A | 2005-02-03 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
Download PDF: