Title:
SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2021/176505
Kind Code:
A1
Abstract:
This substrate processing device is provided with: a substrate holder for holding a substrate; a reaction pipe housing the substrate holder; a heater unit disposed around and over the reaction pipe; and a housing unit configured to house one or both of a gas supply nozzle disposed laterally of the reaction pipe and extending horizontally from the outside of the reaction pipe toward the inside of the reaction pipe with respect to a surface of the substrate held by the substrate holder, and a first temperature measurement unit extending horizontally from the outside of the reaction pipe toward the inside of the reaction pipe with respect to a surface of the substrate held by the substrate holder. With the substrate processing device, it is possible to subject the substrate held by the substrate holder to a uniform film-forming process.
Inventors:
OKAJIMA YUSAKU (JP)
YAMAGUCHI TAKATOMO (JP)
YAMAGUCHI TAKATOMO (JP)
Application Number:
PCT/JP2020/008644
Publication Date:
September 10, 2021
Filing Date:
March 02, 2020
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31
Foreign References:
| JP2017055105A | 2017-03-16 | |||
| JP2012227265A | 2012-11-15 | |||
| JP2016157930A | 2016-09-01 | |||
| JP2011195863A | 2011-10-06 | |||
| JP2014139984A | 2014-07-31 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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