Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/090327
Kind Code:
A1
Abstract:
A substrate processing device (1) comprises: a workpiece support (25) configured to be able to support a workpiece (W); and a plurality of light sources (41, 42) that transmit illuminating beams (L1, L2) that include vacuum ultraviolet radiation. The substrate processing device is provided with a light-shielding plate (54) that by allowing the illuminating beams to pass only through openings therein, restricts the regions that the illuminating beams reaching the workpiece illuminate. The substrate processing device is provided with a shifting mechanism (70) that shifts the workpiece support relative to the plurality of light sources so that the illuminated areas of the workpiece where the illuminating beams are incident change with elapsed time. In a substrate processing device of this kind, the plurality of light sources are provided in positions that differ from each other along a direction intersecting the direction in which the workpiece travels as a result of the shifting mechanism shifting the workpiece support.
Inventors:
KOGA NORIHISA (JP)
IWATA KAZUYA (JP)
IWATA KAZUYA (JP)
Application Number:
PCT/JP2023/037904
Publication Date:
May 02, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/20
Domestic Patent References:
| WO2019131144A1 | 2019-07-04 |
Foreign References:
| JP2020118817A | 2020-08-06 | |||
| JP2009212257A | 2009-09-17 | |||
| JP2019189908A | 2019-10-31 | |||
| JP2022158150A | 2022-10-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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