SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Title:

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2022/158365

Kind Code:

A1

Abstract:

Provided are a substrate processing method and a substrate processing apparatus for applying stress to a substrate.　This substrate processing method involves: forming a metal film, in which the volume changes upon oxidation, on the reverse surface of a substrate; forming an oxide film, through which oxygen passes, on the obverse surface of the metal film; and oxidizing the metal film and applying stress to the substrate.

Inventors:

AKIYAMA KOJI (JP)
GAUBERT PHILIPPE (JP)
NAKABAYASHI HAJIME (JP)
TAMURA CHIHIRO (JP)
WARASHINA HISASHI (JP)

Application Number:

PCT/JP2022/000913

Publication Date:

July 28, 2022

Filing Date:

January 13, 2022

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)

International Classes:

H01L21/28; H01L21/02; H01L21/3205; H01L21/768; H01L23/522

Foreign References:

JP2002184855A	2002-06-28
US20170162522A1	2017-06-08
JPH06112201A	1994-04-22
JPH08158036A	1996-06-18
JP2011071202A	2011-04-07