Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE WORK SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/122011
Kind Code:
A1
Abstract:
Provided is a substrate work system which can smoothly transport even a circuit board for which shrinkage of board width or warpage of the board has occurred as a result of reflow processing. A substrate work system (10) re-enters a circuit board (CB), for which reflow processing has been performed by a reflow device (15), on a component mounting line (12) and mounts components thereupon. A production management computer (23) reads board ID recording portions (21A, 21B) of the circuit board (CB) using a bar code reader (22), and from among a registered job list stored on a storage unit (24), retrieves data for a board width of a corresponding board type. On the basis of the board width in the search result, the production management computer (23) sets a rail width for the component mounting line (12). In addition, if the circuit board (CB) subsequent to reflow processing is re-entered on the component mounting line (12), the production management computer (23) again modifies the rail width of the component mounting line (12) on the basis of the shrinkage amount and warpage amount subsequent to reflow processing.

Inventors:
OYAMA SHIGETO (JP)
IISAKA JUN (JP)
Application Number:
PCT/JP2014/053631
Publication Date:
August 20, 2015
Filing Date:
February 17, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/00
Foreign References:
JP2002111290A2002-04-12
JPH06104563A1994-04-15
JPH0616222A1994-01-25
JP2009295776A2009-12-17
JP2003078287A2003-03-14
JP2014027215A2014-02-06
Attorney, Agent or Firm:
NEXT INTERNATIONAL et al. (JP)
Patent business corporation NeXT (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ROLLING PROCESS LEARNING CONTROL DEVICE

Next Patent: VALVE MEMBER AND POURING CONTAINER WITH SAID VALVE MEMBER