SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD OF SAME

WIPO Patent Application WO/2011/138877

A1

Disclosed is a CSP-type surface acoustic wave device such that the bond strength between a surface acoustic wave element and a mounting substrate is high. The disclosed surface acoustic wave device (1) is provided with a surface acoustic wave element (20) having a plurality of electrode pads (23) and a mounting substrate (10). Upon a die attach side (10a) of the mounting substrate (10), the surface acoustic wave element (20) is flip-chip mounted by bumps (30) comprising Au. The mounting substrate (10) has at least one resin layer (12a to 12c) upon which via holes (10e) are formed, a plurality of mounting electrodes (11) which are formed upon the die attach side (10a) of the mounting substrate (10), and via hole conductors (14a). The mounting electrodes (11) are bonded to the electrode pads (23) by the bumps (30). The via hole conductors (14a) are formed within the via holes (10e). The surface layers of the electrode pads (23) and/or the mounting electrodes (11) comprise Au. At least one of the via hole conductors (14a) is disposed below the bumps (30).

SAKANO KIWAMU (JP)
YAMADA SHU (JP)

PCT/JP2011/052369

November 10, 2011

February 04, 2011

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MURATA MANUFACTURING CO (JP)
SAKANO KIWAMU (JP)
YAMADA SHU (JP)

H03H9/25; H01L23/08; H01L23/12; H03H3/08

WO2005002049A1

2005-01-06

JP2008042430A	2008-02-21
JP2006211613A	2006-08-10
JP2004192907A	2004-07-08
JP2004194290A	2004-07-08
JP2008130636A	2008-06-05

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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