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Patent Searching and Data


Title:
TEMPERATURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/158413
Kind Code:
A1
Abstract:
This temperature-sensitive adhesive composition contains at least a side chain crystalline (meth)acrylic polymer, a (meth)acrylic monomer, a polyfunctional (meth)acrylate, and a photo-radical initiator. The temperature-sensitive adhesive composition exhibits ultraviolet radiation curing properties and is a liquid. Among the side chain crystalline (meth)acrylic polymer, the (meth)acrylic monomer, the polyfunctional (meth)acrylate, and the photo-radical initiator, the overall content of the side chain crystalline (meth)acrylic polymer and the (meth)acrylic monomer should be the highest.

Inventors:
NISHIO TOMOHIRO (JP)
MARUTANI KOSUKE (JP)
Application Number:
PCT/JP2016/058297
Publication Date:
October 06, 2016
Filing Date:
March 16, 2016
Export Citation:
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Assignee:
NITTA CORP (JP)
International Classes:
C09J133/00; C09J4/02; C09J7/20; C09J11/06
Foreign References:
JP2009179781A2009-08-13
JP2011099042A2011-05-19
JP2012087218A2012-05-10
JP2009256607A2009-11-05
JP2007254590A2007-10-04
JP2016094569A2016-05-26
Attorney, Agent or Firm:
FUKAI, Toshikazu (JP)
Toshikazu Fukai (JP)
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