Title:
TEMPERATURE SENSOR AND TEMPERATURE MEASUREMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/261722
Kind Code:
A1
Abstract:
Provided are a temperature sensor and temperature measurement system that make it possible to enhance workability and ease of assembly. This temperature sensor (1) is for measuring the temperature of a resin (120) that a mold (110) of a resin molding apparatus (100) is filled with. The temperature sensor (1) is a grounded sheathed thermocouple having, at the distal end thereof, a contact for measuring the temperature of a resin (120) and comprising: a metallic sheath (10) having a bottomed cylinder shape; a pair of thermocouple wires (20) accommodated inside the metallic sheath (10); and an insulating body (30) provided inside the metallic sheath (10) around the pair of thermocouple wires (20). Further, the temperature sensor (1) additionally comprises a housing (40) covering the periphery of a distal end part of the metallic sheath (10) and the distal end of the metallic sheath (10) has a flat shape.
Inventors:
OKAMOTO TAKUMA (JP)
SHIMOYAMA RYOTA (JP)
SHIMOYAMA RYOTA (JP)
Application Number:
PCT/JP2020/016657
Publication Date:
December 30, 2020
Filing Date:
April 16, 2020
Export Citation:
Assignee:
MINEBEA MITSUMI INC (JP)
International Classes:
G01K7/02; G01K1/08
Foreign References:
| JP2014109462A | 2014-06-12 | |||
| JPH03234518A | 1991-10-18 | |||
| JPH0411997B2 | 1992-03-03 | |||
| US7789559B2 | 2010-09-07 |
Other References:
See also references of EP 3992597A4
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (JP)
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