Title:
TERMINAL BONDING STRUCTURE FOR WIRE AND ELECTRODE FOR RESISTANCE-WELDING
Document Type and Number:
WIPO Patent Application WO/2014/199914
Kind Code:
A1
Abstract:
A terminal bonding structure for a wire (1) obtained by resistance-welding a core (11) of a wire (1) to a connection terminal (2), wherein the core is such that thin sections (13) and a thick section (14) are respectively formed on a fusion bonding part (11a) of the core and the fusion bonding part is resistance-welded to the connection terminal, the thin sections being formed in at least two positions along the longitudinal direction of the core, and the thick section being located between the thin sections and formed so as to be thicker than the thin sections.
Inventors:
KODA YOSHITAKA (JP)
Application Number:
PCT/JP2014/065076
Publication Date:
December 18, 2014
Filing Date:
June 06, 2014
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
H02G15/02; B23K11/00; B23K11/30; H01R4/02; H02G1/14
Foreign References:
| JP2009277674A | 2009-11-26 | |||
| JP2011258732A | 2011-12-22 | |||
| JP2004247236A | 2004-09-02 | |||
| US20110198122A1 | 2011-08-18 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
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