Title:
TEST METHOD AND DEVICE FOR PCB OF SMT
Document Type and Number:
WIPO Patent Application WO/2014/063301
Kind Code:
A1
Abstract:
The solution provides a test method and device for a PCB (Printed Circuit Board) of SMT (Surface Mounted Technology), applicable to the field of electronics. The test method comprises the following steps: acquiring the image data of a steel mesh, after MARK locating is performed on the image data, fitting the open hole shape of the image data as a shape identical to that of a design file of the PCB; generating fitted vector data (S21) of the open hole of the steel mesh; acquiring the image data of the PCB, and after MARK locating is performed on the image data, fitting the bonding pad shape of the image data of the PCB as a shape identical to that of the design file of the PCB; generating fitted vector data (S22) of the bonding pad of the PCB; and comparing the vector data of the open hole of the steel mesh with the vector data of the bonding pad of the PCB, if they are the same, determining that the PCB and the steel mesh are qualified, otherwise determining that they are unqualified and raising the alarm (S23). The technical solution has the advantage of improving the detection precision of a PCB.
Inventors:
LUO YI (CN)
Application Number:
PCT/CN2012/083356
Publication Date:
May 01, 2014
Filing Date:
October 23, 2012
Export Citation:
Assignee:
LUO YI (CN)
International Classes:
G06F19/00
Foreign References:
| CN102927903A | 2013-02-13 | |||
| CN102183215A | 2011-09-14 | |||
| CN1401107A | 2003-03-05 | |||
| CN1504742A | 2004-06-16 | |||
| CN101229711A | 2008-07-30 |
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