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Title:
THERMAL CONDUCTIVE SHEET AND POWER MODULE
Document Type and Number:
WIPO Patent Application WO/2012/070289
Kind Code:
A1
Abstract:
The present invention is a thermal conductive sheet characterized by comprising secondary particles composed of boron nitride primary particles and matrix resin, wherein the secondary particles are deformed and the deformed secondary particles surface contact each other. The ratio of the matrix resin that exists between the secondary particles in this thermal conductive sheet is preferably 5 volume%-50 volume%. This thermal conductive sheet has advantages in productivity and cost, and has excellent thermal conductivity in a sheet thickness direction and electric insulation.

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Inventors:
MIMURA KENJI (JP)
NISHIMURA TAKASHI (JP)
MASAKI MOTOKI (JP)
YAMAMOTO KEI (JP)
Application Number:
PCT/JP2011/069020
Publication Date:
May 31, 2012
Filing Date:
August 24, 2011
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
MIMURA KENJI (JP)
NISHIMURA TAKASHI (JP)
MASAKI MOTOKI (JP)
YAMAMOTO KEI (JP)
International Classes:
C08K3/38; C08L101/00; H01L23/373; H05K7/20
Domestic Patent References:
WO2008035614A12008-03-27
WO2009041300A12009-04-02
Foreign References:
JP2010157563A2010-07-15
JP2009227947A2009-10-08
JP2005117860A2005-04-28
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
Michiharu Soga (JP)
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Claims:



 
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