Title:
THERMALLY CONDUCTIVE ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/019075
Kind Code:
A1
Abstract:
This thermally conductive adhesive sheet is formed by molding, into a sheet shape, a resin composition comprising (A) conductive particles, (B) a thermosetting resin, (C) a block copolymer, and (D) a binder resin, wherein the (C) block copolymer is at least one selected from the group consisting of a triblock or higher copolymer composed of poly(methyl methacrylate) and poly(butyl acrylate), and a triblock or higher copolymer composed of poly(styrene), poly(butadiene), and poly(methyl methacrylate).
Inventors:
ARAKAWA YOSUKE (JP)
OKANO KAZUNORI (JP)
OKANO KAZUNORI (JP)
Application Number:
PCT/JP2021/024896
Publication Date:
January 27, 2022
Filing Date:
July 01, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C08G59/20; C09J7/30; C09J11/04; C09J11/08; C09J163/00; C09J201/00; H01B1/22
Domestic Patent References:
| WO2015151136A1 | 2015-10-08 |
Foreign References:
| JP2013527869A | 2013-07-04 | |||
| JP2018511142A | 2018-04-19 | |||
| JP2016048746A | 2016-04-07 | |||
| JP2016222804A | 2016-12-28 | |||
| JP2012172128A | 2012-09-10 | |||
| JP2018198133A | 2018-12-13 | |||
| JP2014043507A | 2014-03-13 | |||
| JP2016536467A | 2016-11-24 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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