Title:
THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET-FORM MOLDED FOAM, AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2005/059053
Kind Code:
A1
Abstract:
A thermally conductive pressure-sensitive adhesive composition which comprises a metal hydroxide and a (meth)acrylic ester copolymer obtained by polymerizing a monomer mixture comprising a (meth)acrylic ester monomer forming a homopolymer having a glass transition temperature of -20°C or lower, a monomer having an organic acid group, and a monomer copolymerizable therewith, in the presence of a copolymer comprising units of a (meth)acrylic ester monomer forming a homopolymer having a glass transition temperature of -20°C or lower, units of a monomer having an organic acid group, units of a monomer having a functional group other than the organic acid group, and units of a monomer copolymerizable therewith, the (meth)acrylic ester copolymer having been foamed. The composition has an excellent balance between hardness and pressure-sensitive adhesive properties. It has performances including excellent shape conformability. It can be provided as a sheet which can be easily formed. The sheet obtained can be easily stripped from the adherend after use. Also provided is a thermally conductive sheet-form molded foam comprising the composition.
Inventors:
MIKUNI TAKAMITU (JP)
IWABUCHI SATOSI (JP)
OGIWARA MANABU (JP)
IWABUCHI SATOSI (JP)
OGIWARA MANABU (JP)
Application Number:
PCT/JP2004/018634
Publication Date:
June 30, 2005
Filing Date:
December 14, 2004
Export Citation:
Assignee:
ZEON CORP (JP)
MIKUNI TAKAMITU (JP)
IWABUCHI SATOSI (JP)
OGIWARA MANABU (JP)
MIKUNI TAKAMITU (JP)
IWABUCHI SATOSI (JP)
OGIWARA MANABU (JP)
International Classes:
B32B5/18; B32B27/30; C08J9/06; C08K3/36; C08L33/04; C09J5/08; C09J7/00; C09J7/02; C09J9/00; C09J11/04; C09J133/04; H01L23/373; C08K3/22; (IPC1-7): C09J133/04; B32B5/18; B32B27/30; C08J9/06; C08K3/22; C08K3/36; C08L33/04; C09J7/00
Foreign References:
| JP2002322447A | 2002-11-08 | |||
| JP2002322449A | 2002-11-08 | |||
| JP2002285121A | 2002-10-03 | |||
| JPH07102232A | 1995-04-18 | |||
| JPH07157736A | 1995-06-20 | |||
| JP2002128931A | 2002-05-09 | |||
| JP2002134666A | 2002-05-10 |
Attorney, Agent or Firm:
Hoshino, Tetsuro c/o Tokyo, Central Patent Firm (4th Floor Oak Building Kyobashi, 16-10,
Kyobashi 1-chome, Chuou-k, Tokyo 31, JP)
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