Title:
THERMOCONDUCTIVE RESIN COMPOSITION, THERMOCONDUCTIVE SHEET, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/014238
Kind Code:
A1
Abstract:
The thermoconductive resin composition according to a first aspect of the present invention includes an epoxy resin, a cyanate resin, and a thermoconductive filler, the thermal conductivity thereof at 25°C measured by a specific thermal conductivity test is 3 W/(m∙K) or greater, and the thermoconductive resin composition does not crack when subjected to a specific flex resistance test. The thermoconductive resin composition according to a second aspect of the present invention includes an epoxy resin, a thermoconductive filler, and silica nanoparticles, the average particle diameter D50 of the silica nanoparticles measured by dynamic light scattering is 1 nm to 100 nm, the content of the silica nanoparticles is 0.3% by mass to 2.5% by mass with respect to a total solid content of 100% by mass of the thermoconductive resin composition, and the thermoconductive filler includes secondary aggregate particles configured from primary particles of flake boron nitride.
Inventors:
TSUDA MIKA (JP)
HATANO HARUYUKI (JP)
KITAGAWA KAZUYA (JP)
NAGAHASHI KEITA (JP)
HATANO HARUYUKI (JP)
KITAGAWA KAZUYA (JP)
NAGAHASHI KEITA (JP)
Application Number:
PCT/JP2016/071287
Publication Date:
January 26, 2017
Filing Date:
July 20, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L79/04; C08K3/00; C08K3/36; C08K3/38; C08L63/00; H01L23/36; H01L23/373
Domestic Patent References:
| WO2013183303A1 | 2013-12-12 |
Foreign References:
| JP2013133465A | 2013-07-08 | |||
| JP2014031436A | 2014-02-20 | |||
| JP2016094599A | 2016-05-26 | |||
| JP2015151483A | 2015-08-24 | |||
| JP2015146386A | 2015-08-13 | |||
| JPH10173097A | 1998-06-26 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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