Title:
THERMOSETTING ADHESIVE
Document Type and Number:
WIPO Patent Application WO2002079338
Kind Code:
A3
Abstract:
A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.
Inventors:
TAKEDA MASAAKI (JP)
KAWATE KOHICHIRO (JP)
ISHII SHIGEYOSHI (JP)
TORIUMI NAOYUKI (JP)
ITOH KOJI (JP)
HARA TOMIHIRO (JP)
KAWATE KOHICHIRO (JP)
ISHII SHIGEYOSHI (JP)
TORIUMI NAOYUKI (JP)
ITOH KOJI (JP)
HARA TOMIHIRO (JP)
Application Number:
PCT/US2002/008802
Publication Date:
November 28, 2002
Filing Date:
March 21, 2002
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
TAKEDA MASAAKI (JP)
KAWATE KOHICHIRO (JP)
ISHII SHIGEYOSHI (JP)
TORIUMI NAOYUKI (JP)
ITOH KOJI (JP)
HARA TOMIHIRO (JP)
TAKEDA MASAAKI (JP)
KAWATE KOHICHIRO (JP)
ISHII SHIGEYOSHI (JP)
TORIUMI NAOYUKI (JP)
ITOH KOJI (JP)
HARA TOMIHIRO (JP)
International Classes:
C09J163/00; C08G59/68; C08K5/36; C08K5/375; C09J7/35; C09J123/08; C08L23/08; (IPC1-7): C09J123/08; C08K5/375; C09J11/06
Domestic Patent References:
| WO2000000566A1 | 2000-01-06 |
Foreign References:
| US6057382A | 2000-05-02 | |||
| EP0555058A1 | 1993-08-11 |
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