THERMOSETTING COMPOSITION FOR ELECTROCHEMICAL CELL COMPONENTS AND METHODS OF MAKING THEREOF

WIPO Patent Application WO2002015302

A3

A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composittion comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 1.006 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter DEG K.

FITTS BRUCE B
LANDI VINCENT R
ROY SAROJ K

PCT/US2001/041713

January 23, 2003

August 14, 2001

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WORLD PROPERTIES INC (US)

C08J5/00; H01B1/04; H01B1/20; H01B1/24; H01M2/14; H01M4/00; H01M4/66; H01M8/02; (IPC1-7): H01M8/02; H01B1/20

EP0297888A1	1989-01-04
EP0109824A1	1984-05-30
GB1264741A	1972-02-23

DATABASE WPI Section Ch Week 198730, Derwent World Patents Index; Class A12, AN 1987-210844, XP002210989
DATABASE WPI Section Ch Week 198706, Derwent World Patents Index; Class A85, AN 1987-040175, XP002210990
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22)

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