THERMOSETTING EPOXY RESIN COMPOSITION AND USE THEREOF

Title:

THERMOSETTING EPOXY RESIN COMPOSITION AND USE THEREOF

Document Type and Number:

WIPO Patent Application WO/2006/064736

Kind Code:

A1

Abstract:

A liquid thermosetting epoxy resin composition which comprises: a main ingredient comprising an alicyclic epoxy compound having in the molecule a cyclic aliphatic skeleton and two or more epoxy groups and a polyol oligomer having two or more terminal hydroxy groups; a hardener; and a hardening accelerator. Alternatively, the composition comprises the main ingredient and a hardening catalyst. The liquid thermosetting epoxy resin composition is free from the problem that hardening results in the generation of a part having a hardening failure. Consequently, a cured resin obtained by curing the liquid thermosetting epoxy resin composition is optically homogeneous and has a low flexural modulus, a high flexural strength, a high glass transition temperature, and high transparency. It is suitable for use in optical semiconductors, etc.

Inventors:

TAKAI HIDEYUKI (JP)
HIRAKAWA HIROYUKI (JP)

Application Number:

PCT/JP2005/022668

Publication Date:

June 22, 2006

Filing Date:

December 09, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DAICEL CHEM (JP)
TAKAI HIDEYUKI (JP)
HIRAKAWA HIROYUKI (JP)

International Classes:

C08G59/40; C08L63/00; C08L67/00; C08L69/00; H01L23/29; H01L23/31; H01L33/48; H01L33/56

Foreign References:

JPH08311168A	1996-11-26
JPH06298900A	1994-10-25
JP2004203943A	2004-07-22
JP2001166127A	2001-06-22
JP2001011416A	2001-01-16
JP2000204108A	2000-07-25
JP2002212396A	2002-07-31
JPH09255764A	1997-09-30
JPH10156952A	1998-06-16
JP2000063485A	2000-02-29
JPH0971636A	1997-03-18

Other References: