Title:
THIN FILM CAPACITOR, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC CIRCUIT BOARD PROVIDED WITH THIN FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/157426
Kind Code:
A1
Abstract:
[Problem] To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same surface. [Solution] A thin film capacitor 1 comprises a metal foil 10 having an unroughened central portion 13 and a roughened upper surface 11, a dielectric film D covering the roughened upper surface 11 of the metal foil 10, an electrode layer 31 contacting the unroughened central portion 13 of the metal foil 10 through an opening portion provided in the dielectric film D, and an electrode layer 32 contacting the dielectric film D without contacting the metal foil 10. The central portion 13 of the metal foil 10 has a thickness T1 at a position overlapping with the electrode layer 31 than a thickness T2 at a position overlapping with the electrode layer 32.
Inventors:
HARADA YASUNORI (JP)
HAYAMIZU YOSHIAKI (JP)
ISHII DAIKI (JP)
TOMIKAWA MITSUHIRO (JP)
YOSHIDA KENICHI (JP)
HAYAMIZU YOSHIAKI (JP)
ISHII DAIKI (JP)
TOMIKAWA MITSUHIRO (JP)
YOSHIDA KENICHI (JP)
Application Number:
PCT/JP2022/044514
Publication Date:
August 24, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01G4/33; H01L23/12
Domestic Patent References:
| WO2022004013A1 | 2022-01-06 | |||
| WO2018008625A1 | 2018-01-11 | |||
| WO2017026233A1 | 2017-02-16 |
Foreign References:
| JP2018082013A | 2018-05-24 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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