Title:
THIN FILM DEPOSITION METHOD AND DEPOSITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/178167
Kind Code:
A1
Abstract:
Provided is a method for low-cost deposition of a durable thin film. This deposition method uses a deposition device (1). This device (1) includes a vacuum chamber (11) in which a substrate (100) is arranged at the bottom, a vacuum pump which evacuates the chamber (11), a storage container (23) which is provided outside of the chamber (11) and which stores a film deposition solution (21), and a nozzle (17) which at one end has a discharge unit (19) which can discharge the film deposition solution (21). As the film deposition solution (21), a solution is used which is made up of two or more materials, including a first material (S1) and a second material (S2) having higher vapor pressure (P2) than the vapor pressure (P1) of the first material (S1). The film deposition solution (21) is discharged onto the substrate (100) in an environment in which the pressure is higher than P1 and lower than P2.
Inventors:
SAMORI SHINGO (JP)
TAKASE SHINICHI (JP)
SUGAWARA SATOSHI (JP)
NAGAE EKISHU (JP)
JIANG YOUSONG (JP)
TAKASE SHINICHI (JP)
SUGAWARA SATOSHI (JP)
NAGAE EKISHU (JP)
JIANG YOUSONG (JP)
Application Number:
PCT/JP2015/062618
Publication Date:
November 26, 2015
Filing Date:
April 24, 2015
Export Citation:
Assignee:
SHINCRON CO LTD (JP)
International Classes:
B05C9/10; B05D3/00
Foreign References:
| JP2004087465A | 2004-03-18 | |||
| JP2001252600A | 2001-09-18 | |||
| JP2003257631A | 2003-09-12 |
Attorney, Agent or Firm:
OHKURA, Koichiro et al. (JP)
Koichiro Okura (JP)
Koichiro Okura (JP)
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